古奇& Hous金宝搏官网ego提供各种各样的大小和厚度与晶圆直径75 - 125毫米不等。标准的厚度是0.5毫米,0.7 mm and 1.0 mm. The standard orientations are x-axis and z-axis growth. Lithium niobate is available in two compositions: congruent and 5.0 mol % magnesium doped.
可以追溯到1967年,producing the first commercially available material. Since that time we have constantly refined the growth and material processing to be able to produce the highest quality,最一致的LiNbO
Congruent lithium niobate works well for IR light sources. Magnesium doping improves the resistance to photorefractive damage in the visible wavelengths. While the majority of lithium niobate wafers are double side polished,single side polished wafers are also available. Typical applications for lithium niobate are waveguides,低通滤波器,光电隔离器和渥拉斯顿棱镜。
wafers. High purity powders are measured to assure consistent composition. Computers monitor the growth process and ensure all facets are properly managed and recorded. Thermal gradients inside the furnaces are tightly controlled to minimize stresses and strain on the crystal. This attention to detail has been the cornerstone of our commitment to making the best material possible.
Many steps are required to take an as-grown crystal and shape it into its final form. An optical wafer will go through the following processing steps:
As-grown lithium niobate boules will have randomly oriented ferroelectric domains throughout the material. The poling process aligns the ferroelectric domains along the z-axis. The boules are heated beyond their Curie temperature (1142 [Symbol]C) and an electric field is applied across the z-axis. As the boule is cooled,铁电域锁与z轴和水晶变得单一域。
After poling the boule is shaped into a cylinder. Diamond tools are used to crop the ends of the boule and grind the outside into a cylinder. This process sets the diameter of the wafers. X-rays are used to orient the crystal axis. More diamond tools are used to grind the major and minor orientation flats. The crystal orientation is maintained to better than 6 minutes.
Individual wafers are cut from the cylindrical boule. X-rays are used to align the wafer face. An inner diameter saw is used to cut individual wafers. Critical cutting parameters monitored include feed rate,索引、和叶偏转。
A radius profile is ground on the outside edge of the wafer. The curved profile makes the wafer more resistant to cracking and chipping during processing. Our edge grinders are state-of-the-art automated machines with a cassette-to-cassette operation and wafer thickness verification.
Lapping is a double-sided grinding process that removes any subsurface damage caused by the slicing process. After lapping,the wafers will have a more uniform thickness and be much flatter. The wafers then go through a chemical etching process that removes stresses in the crystal built-up by previous processing.
Single sided and double sided polishing are available. Customized polishing plates and carriers allow for maximum productivity while maintaining surface quality. The typical finish of our polished wafers is R
完成了晶片100%视力检查划痕等缺陷,挖,空洞,夹杂物,and grain boundaries. Various optical techniques are used to characterize the stress and strain in the wafer. After inspection,在洁净室环境中,晶片包装和密封的装运。